Bergquist Company GAP PAD HC 5.0 Thermal Interface

Bergquist Company GAP PAD HC 5.0 Thermal Interface is a new silicon-based 5.0 W/m-K high compliance GAP PAD that is non-electrically conductive and highly conformable. The HC5.0 GAP PAD is available in various thicknesses and custom part sizes and features low hardness and modules. The thermal interface is tacky on one side with clear PET liner with reduced tack on one side with Blue Diamond liner. The GAP PAD HC 5.0 is easily reworkable.